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PIC16F1946-I/MR
器件3D模型
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PIC16F1946-I/MR数据手册
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2010-2014 Microchip Technology Inc. DS80000497G-page 5
PIC16(L)F1946/1947
In Figure 1, 88 instruction cycles (TCY) will be
required to complete the full conversion. Each T
AD
cycle consists of eight TCY periods. A fixed delay is
provided to stop the A/D conversion after 86
instruction cycles and terminate the conversion at
the correct time as shown in the figure above.
EXAMPLE 1: CODE EXAMPLE OF
INSTRUCTION CYCLE
DELAY
For other combinations of FOSC, TAD values and
Instruction cycle delay counts, refer to Tabl e 3.
TABLE 3: INSTRUCTION CYCLE DELAY
COUNTS FOR OTHER F
OSC
AND T
AD COMBINATIONS
Affected Silicon Revisions
3. Module: Brown-out Reset (BOR)
3.1 Brown-out Reset
If MCLR
is used to wake the device, while the BOR
is set to Sleep and the part is in Sleep, the BOR bit
of the PCON register will be cleared without VDD
dropping below the BOR level.
Work around
None.
Affected Silicon Revisions
3.2 Brown-out Reset
This issue affects only the PIC16LF1946/1947
devices. The device may undergo a BOR Reset
when waking up from Sleep and BOR is re-
enabled. A BOR Reset may also occur the
moment the software BOR is enabled.
Under certain voltage and temperature condi-
tions, after waking from Sleep, if either
BOR_nSLEEP is enabled or the SBODEN is
enabled, the device may reset.
Method 1: In applications where BOR use is
not critical, turn off the BOR in the
Configuration Word.
Method 2: Set the FVREN bit of the
FVRCON register. Maintain this
bit on at all times.
Method 3: When the BOR module is needed
only during run-time, use the
software-enabled BOR by setting
the SBODEN option on the
Configuration Word. BOR should
be turned off by software before
Sleep, then follow the below
sequence for turning BOR on
after wake-up:
a) Wake-up event occurs;
b) Turn on FVR (FVREN bit of the
FVRCON register);
c) Wait until FVRRDY bit is set;
d) Wait 15 µs after the FVR Ready
bit is set;
e) Manually turn on the BOR.
Note: The exact delay time will depend on the
choice of F
OSC and the TAD divisor
(ADCS) selection. The T
CY counts shown
in the timing diagram above apply to this
example only. Refer to Table 3 for the
required delay counts for other
configurations.
F
OSC TAD
Instruction Cycle Delay
Counts
32 MHz
F
OSC/64 172
FOSC/32 86
16 MHz
F
OSC/64 172
F
OSC/32 86
F
OSC/16 43
8 MHz
FOSC/32 86
F
OSC/16 43
A2 A3 A4 A5 A6
X
BSF ADCON0, ADGO ; Start ADC conversion
; Provide 86
instruction cycle
delay here
BCF ADCON0, ADGO ; Terminate the
conversion manually
MOVF ADRESH, W ; Read conversion
result
A2 A3 A4 A5 A6
XXXX

PIC16F1946-I/MR 数据手册

Microchip(微芯)
459 页 / 4.03 MByte
Microchip(微芯)
46 页 / 0.5 MByte
Microchip(微芯)
13 页 / 0.11 MByte
Microchip(微芯)
24 页 / 0.47 MByte
Microchip(微芯)
3 页 / 0.11 MByte

PIC16F1946 数据手册

Microchip(微芯)
64引脚基于闪存的8位CMOS微控制器与LCD驱动器,并采用nanoWatt XLP技术 64-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver and nanoWatt XLP Technology
Microchip(微芯)
MICROCHIP  PIC16F1946-I/PT  微控制器, 8位, 闪存, AEC-Q100, PIC16F19xx, 32 MHz, 14 KB, 512 Byte, 64 引脚, TQFP
Microchip(微芯)
8位微控制器 -MCU 14KB Flash, 512B RAM LCD, 1.8-5.5V
Microchip(微芯)
MICROCHIP  PIC16F1946-E/PT  微控制器, 8位, 闪存, AEC-Q100, PIC16F19xx, 32 MHz, 14 KB, 512 Byte, 64 引脚, TQFP
Microchip(微芯)
PIC16F1946/1947 8 位闪存微控制器Microchip 的 PIC16F 系列微控制器 8 位 MCU,将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中,从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 带有基线、中级或增强型中级体系架构的设备提供多种不同的外围设备组合,可谓设计人员提供灵活性,并为应用提供选择。 PIC16F1946/1947 系列微控制器基于 Microchip 的增强型中级内核,带 16 层深硬件堆栈和 49 个指令。 这些 MCU 提供高达 8 个 MIP、28 千字节程序存储器、1024 字节 RAM 和 256 字节数据 EEPROM。 板载可配置振荡器,精确度为 ±1%。### 微控制器功能最大 32 MHz CPU 速度 49 个指令 16 级硬件堆栈 32 MHz 内部振荡器 - 可选频率范围 32 MHz 至 31 kHz 54 个输入/输出引脚 nanoWatt XLP 技术 通电重置 (POR) 通电计时器 (PWRT) 振荡器启动计时器 (OST) 掉电重置 (BOR) 监控器计时器 (WDT) 低电压编程 (LVP) 在线串行编程 (ICSP) 在线调试 (ICD) ### 外设集成 LCD 控制器 - 184 段 10 位模拟到数字转换器 (ADC) - 17 通道 mTouchTM 电容性传感器模块 - 17 通道 两个捕捉/比较/PWM (CCP) 模块 三个增强型捕获/比较/PWM (ECCP) 模块 三个比较器 四个 8 位计时器 一个 16 位计时器 两个主同步串行端口 (MSSP),带 SPI 和 I2C 两个增强型通用同步异步接收器发射器 (EUSART) 固定电压参考 (FVR) SR 闩锁 ### PIC16 微控制器
Microchip(微芯)
Microchip(微芯)
PIC 32MHz 闪存:8K@x14bit
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