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PIC18F14K22-I/P 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-20
描述:
PIC18F1xK22 8 位闪存微控制器PIC18F2x1x/4x1x 系列微控制器基于 PIC18 体系结构，可提供 31 级硬件堆栈和 75 个说明。 这些 MCU 采用极低功耗技术，特别适用于低功耗至关重要的应用。### 微控制器功能最大 16 MIPS CPU 速度 75 指令 - 通过扩展指令集支持 83 指令 31 级硬件堆栈 可配置内部振荡器 - 可选频率范围 16 mHz 至 31 kHz 18 个输入/输出引脚 通电重置 (POR) 通电计时器 (PWRT) 振荡器启动计时器 (OST) 掉电重置 (BOR) 延长监控计时器 (WDT) 在线串行编程 (ICSP) 在线调试 (ICD) ### 极低功耗功能睡眠模式：34 nA 监控计时器：460 nA 计时器 1 振荡器：650 nA @ 32 kHz ### 外设10 位模拟到数字转换器 (ADC) – 12 通道 比较器模块 参考电压模块 三个 16 位计时器 一个 8 位计时器 一个增强型捕获、比较、PWM 模块 主同步串行端口 (MSSP) 模块，带有 SPI 和 I²C 增强型可寻址通用同步异步接收器发送器 (EUSART) SR 闩锁模块 ### PIC18 微控制器
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型号编号列表在P3P59
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PIC18F14K22-I/P数据手册
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若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - GBNG-07ROAS851
Date:
13 Apr 2020
Product Category:
Others; 8-bit Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface- LIN
Transceiver; Interface- Passive-Keyless-Entry Analog Front End; Interface- Serial Peripherals;
Binary and BCD A/D Converters; Display A/D Converters; Linear Comparators; Linear Op Amps;
Linear Programmable Gain Amplifiers; Digital Potentiometers; Dual Slope A/D Converters;
Frequency-to-Voltage / Voltage-to-Frequency Converters; Successive Approximation Register (SAR)
A/D Converters; System D/A Converters; Charge Pump DC-to-DC Converters; Linear Regulators;
Power MOSFET Drivers; Voltage References; Temperature Sensors; Memory; Real-Time
Clock/Calendar; KEELOQ® Decoder Devices; KEELOQ® Encoder Devices; KEELOQ® Transcoder
Devices; USB Bridge; Power Management - PMIC; Power Management - System
Supervisors/Voltage Detectors
Affected CPNs:
Notification subject:
CCB 4203 Final Notice: Qualification of G600V as an additional/alternative mold compound material
for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at
MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of G600V as an additional/alternative mold compound material for selected products
available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site
using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Pre Change:
Using GE800 mold compound material.
Post Change:
Using GE800 or G600V mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch)
(MMT)
Microchip Technology
Thailand (Branch)
(MMT)
Wire material
CuPdAu CuPdAu
Die attach material
CRM-1064L CRM-1064L
Molding compound
material
GE800 GE800 G600V
Lead frame material
CDA194 CDA194
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