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PIC18F4450-I/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-44
描述:
28 /40/ 44引脚，高性能， 12 MIPS ，增强型闪存， USB微控制器采用纳瓦技术 28/40/44-Pin, High-Performance, 12 MIPS, Enhanced Flash, USB Microcontrollers with nanoWatt Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
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应用领域在P1P3
型号编号列表在P4P5P6P7P8
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PIC18F4450-I/ML数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
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Date:
17 Oct 2016
Product Category:
8-bit Microcontrollers; 16-bit Microcontrollers and Digital Signal Controllers
Notification subject:
CCB 2697 Final Notice: Qualification of CuPdAu bond wire in selected products of the 150K and
160K wafer technologies available in 44L QFN (8x8x0.9mm) package at MTAI assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 150K and
160K wafer technologies available in 44L QFN (8x8x0.9mm) package at MTAI assembly site.
Pre Change:
Using gold (Au) bond wire
Post Change:
Using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI assembly site MTAI assembly site
Wire material Au wire Au wire or CuPdAu wire
Die attach material 3280 3280
Molding compound material G700LTD G700LTD
Lead frame material C194 C194
Product Change Notification - JAON-14OICS710
Page 1 of 3Product Change Notification - JAON-14OICS710 - 17 Oct 2016 - CCB 2697 Final Notic
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