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Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability and qualify Palladium coated copper with gold flash (CuPdAu) bond wire
Change Implementation Status:
In Progress
Estimated First Ship Date:
October 22, 2016 (Date code: 1642)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change
parts.
Time Table Summary:
July 2016
->
September 2016 October 2016
Workweek
27 28 29 30 35 36 37 38
39 40 41 42 43 44
Initial PCN Issue
Date
X
Qual Report
Availability
X
Final PCN Issue
Date
X
Estimated
Implementation
Date
X
Method to Identify Change:
Traceability code
Qualification Report:
Please open the attachments included with this PCN labeled as PCN_#_Qual Report.
Revision History:
July 19, 2016: Issued initial notification.
September 22, 2016: Issued final notification. Attached the qualification report. Provided estimated first ship date
on October 22, 2016.
October 17, 2016: Re-issued the final notification to notify all affected customers.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.
Attachment(s):
PCN_ JAON-14OICS710_Qual report.pdf
PCN_JAON-14OICS710_Affected_CPN.pdf
PCN_JAON-14OICS710_Affected_CPN.xlsx
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
If you wish to change your product/process change notification (PCN) profile please log on to our website at
http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from
Page 2 of 3Product Change Notification - JAON-14OICS710 - 17 Oct 2016 - CCB 2697 Final Notic
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