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RS1D-13-F
0.303
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  • 焊盘布局在P3
  • 应用领域在P1
RS1D-13-F数据手册
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V1.025/02/13
Surface Mount Rectifier
Features:
Low Prole Package
For Surface Mounted Applications
Built-In Strain Relief, Ideal for Automated Placement
High Temperature Soldering : 260°C/10 seconds at Terminals
Mechanical Data
Case : JEDEC SMA, molded plastic over passivated chip
Terminals : solder plated, solderable per MIL-STD-750, method 2026
Polarity : Colour band denotes cathode end
Weight : 0.002oz, 0.064g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) Reverse recovery time test conditions : I
F=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1MHz and applied reverse voltage of 4V
(3) Thermal resistance from junction to lead
Characteristic Symbol RS1D-13-F RS1J-13-F RS1K-13-F RS1M-13-F Units
Maximum repetitive peak reverse voltage V
RRM 200 600 800 1,000 V
Maximum RMS voltage V
RMS 140 420 560 700 V
Maximum DC blocking voltage V
DC 200 600 800 1,000 V
Maximum average forward rectied current at
T
L=90°C
IF(AV) 1 A
Peak forward surge current 8.3ms single
half-sine-wave superimposed on rated load
I
FSM 30 A
Maximum Instantaneous Forward Voltage
at 1A
V
F 1.3 V
Maximum DC reverse current T
A=25°C
at rated DC blocking voltage TA=125°C
IR
5
50
μA
Typical reverse recovery time (Note 1) t
IT 150 250 500 ns
Typical junction capacitance (Note 2) C
J 10 7 pF
Typical thermal resistance (Note3)
R
θJA
RθJL
105
32
°C/W
Operating junction and storage temperature
range
T
J, TSTG -55 to +175 °C

RS1D-13-F 数据手册

Multicomp
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