Datasheet 搜索 > 中高压MOS管 > ST Microelectronics（意法半导体） > STD11N65M2 数据手册 > STD11N65M2 其他数据使用手册 1/4 页
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STD11N65M2 其他数据使用手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
中高压MOS管
封装:
TO-252-3
描述:
STMICROELECTRONICS STD11N65M2 功率场效应管, MOSFET, N沟道, 7 A, 650 V, 0.6 ohm, 10 V, 3 V
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编码规则在P1
封装信息在P1P3
功能描述在P1
应用领域在P1
导航目录
STD11N65M2数据手册
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若手册格式错乱，请下载阅览PDF原文件
FOR MORE INFORMATION, VISIT OUR WEB SITE:WWW.AAVIDTHERMALLOY.COM
TEL: (603) 224-9988
Surface Mount Heat Sinks
For D-PAK,D
2
PAK,D
3
PAK,and SO-10
ORDERING INFORMATION:
Part Number Description Packaging
573300D00000G Surface mount heat sink for TO-263 Bulk 500 per bag
573300D00010G Surface mount heat sink for TO-263 13" Reel 250/per reel
573400D00000G Surface mount heat sink for TO-268 Bulk 500 per bag
573400D00010G Surface mount heat sink for TO-268 13" Reel 250/per reel
573100D00000G Surface mount heat sink for TO-252 Bulk 500 per bag
573100D00010G Surface mount heat sink for TO-252 13" Reel 250/per reel
7106DG Surface mount heat sink for SO-10 / Power SO-10 / TO-263 Bulk 500 per bag
7106D/TRG Surface mount heat sink for SO-10 / Power SO-10 / TO-263 13" Reel 200/per reel
7109DG Surface mount heat sink for TO-263 Bulk 500 per bag
7109D/TRG Surface mount heat sink for TO-263 13" Reel 125/per reel
NEW RoHS Compliant
SURFACE MOUNT HEAT SINKS
The Aavid Thermalloy line of low profile surface mount
heat sinks are suitable for SMT power semiconductor
devices in D-PAK,D
2
PAK,D
3
PAK and SO-10 packages.
Their unique design removes heat indirectly through
conduction without making contact with the SMT
device like traditional through hole solutions.The semi-
conductor’s conventional copper drain pad is modified to
extend beyond the edges of the semiconductor package
providing space to mount the heat sink.The device and
heat sink are soldered directly to the modified drain pad
creating a thermal transfer path from the package tab
to the surface mount heat sink.In addition,the elevated
"Wings" of the heat sink provide ample surface area to
dissipate the heat into the surrounding environment.
FEATURES AND BENEFITS:
• RoHS compliant 100% matte tin
plating with nickel underplate
• No attachment holes required
in the printed circuit board
• Wing configuration will not
interfere with adjacent components
• Available in tape and reel packaging for use
with automated SMT pick and place equipment
• Compatible with both tin-lead
and lead free (Sn/Ag/Cu) solders
APPLICATIONS:
• Power Supplies
• Telecommunication Equipment
• Motor Controls
• Medical Equipment
• Industrial Process Control Equipment
• Consumer Products
RoHS
Compliant
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