Datasheet 搜索 > 微控制器 > ST Microelectronics(意法半导体) > STM32F103R8T6 数据手册 > STM32F103R8T6 产品修订记录 2/14 页


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STM32F103R8T6 产品修订记录 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
LQFP-64
描述:
STMICROELECTRONICS STM32F103R8T6 微控制器, 32位, 电机控制, ARM 皮质-M3, 72 MHz, 64 KB, 20 KB, 64 引脚, LQFP
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3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P12
技术参数、封装参数在P14
应用领域在P14
型号编号列表在P2
导航目录
STM32F103R8T6数据手册
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PCN MMS-MIC/14/8685 - Dated 03 Oct 2014
Table 1. Change Implementation Schedule
Forecasted implementation date for 10-Feb-2015
change
Forecasted availability date of samples 10-Jan-2015
for customer
Forecasted date for STMicroelectronics
change Qualification Plan results availability 10-Jan-2015
Estimated date of changed product first 10-Feb-2015
shipment
Table 2. Change Identification
Product Identification LQFP 64 10x10 package products
(Product Family/Commercial Product)
Type of change Assembly additional location
Reason for change To increase assembly capacity
Description of the change ST Microcontrollers Division has decided to add a High Density Matrix
leadframe line in Muar (Malaysia) assembly site, for LQFP 64 10x10
products listed below. The objective is to increase assembly
capacity. The assembly plants and Bill Of Materials are changed as
indicated below.
Change Product Identification See indicated below
Manufacturing Location(s)
®
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