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STM32F103R8T6 产品修订记录 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
LQFP-64
描述:
STMICROELECTRONICS STM32F103R8T6 微控制器, 32位, 电机控制, ARM 皮质-M3, 72 MHz, 64 KB, 20 KB, 64 引脚, LQFP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P12
技术参数、封装参数在P14
应用领域在P14
型号编号列表在P2
导航目录
STM32F103R8T6数据手册
Page:
of 14 Go
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PRODUCT/PROCESS
CHANGE NOTIFICATION
Conversion to High Density Matrix Leadframe –
LQFP 64 10x10 products listed below
MMS - Microcontrollers Division (MCD)
Dear Customer,
ST Microcontrollers Division has decided to add a High Density Matrix
leadframe line in Muar (Malaysia) assembly site, for LQFP 64 10x10 products
listed below.
The objective is to increase assembly capacity.
What are the changes?
On LQFP 64 10x10 products listed below, the assembly plants and Bill Of
Materials are as below:
Current
Assembly site
Bill Of Materials (BOM)
Muar (Malaysia)
Leadframe
PrePlated Frame (PPF)
Die attached material
Hitachi EN4900
Molding compound
Sumitomo G700F
Wire
Gold 1.0mil
STATS ChipPAC
Shanghai (China)
Leadframe
Pure Sn
Die attached material
Ablestik 3230
Molding compound
Sumitomo G700E
Wire Gold 0.8mils
New
Assembly site
Bill Of Materials (BOM)
Muar (Malaysia)
Leadframe
Pure Sn
Die attached material
Hitachi EN4900GC
Molding compound
Sumitomo G700LS
Wire
Gold 0.8mils
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