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TFP410MPAPREP 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
TQFP-64
描述:
TEXAS INSTRUMENTS TFP410MPAPREP. 芯片, 数字发送器, 3.6V, HTQFP-64
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TFP410MPAPREP数据手册
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Texas Instruments, Inc. PCN# 20140926000
PCN Number:
20140926000
PCN Date:
10/01/2014
Title:
Qualification of 4211649 Mold Compound for Selected PowerPad QFP Device(s)
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality
Services
Proposed 1
st
Ship Date:
04/01/2015
Estimated Sample
Availability:
Date provided at sample
request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of 4211649 Mold Compound for
Selected PowerPad QFP devices listed in “Product affected” section below. Devices will remain in
current assembly facility and there will be no other piece part changes.
From
To
Mold Compound
4205443
4211649
Reason for Change:
Continuity of supply.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None.
Changes to product identification resulting from this PCN:
None.
Product Affected:
ADS1258IPHPREP
DAC5687MPZPEP
TSB41BA3BTPFPEP
V62/06669-01XE
ADS1258MPHPTEP
DP83848MPHPEP
TSB81BA3IPFPEP
V62/07607-01XE
ADS1278MPAPTEP
DP83848MPHPREP
V62/03608-03XE
V62/09624-01YE
ADS5292MPFPEP
SM320F28335PTPMEP
V62/03612-01XE
V62/09626-01YE
ADS5294MPFPEP
TFP401AMPZPEP
V62/04612-01XE
V62/09626-02XE
ADS5440MPFPEP
TFP410MPAPREP
V62/05613-01XE
V62/09626-02YE
ADS5444MPFPEP
TFP410MPAPREPG4
V62/05613-02XE
V62/09627-01XE
ADS5463MPFPEP
THS1408MPHPEP
V62/05619-01XE
V62/10604-01XE
ADS5500MPAPEP
THS8200IPFPEP
V62/05619-02XE
V62/12600-01EX
ADS5500MPAPREP
TSB41AB3IPFPEP
V62/06650-01XE
V62/12615-01XE
DAC5675MPHPEP
TSB41AB3MPFPEP
V62/06653-01XE
V62/12615-01XE-R
DAC5675MPHPREP
TSB41BA3ATPFPEP
V62/06668-01XE
XSM320F28335PTPS
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