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器件3D模型￥ 76.976
TFP410MPAPREP 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
TQFP-64
描述:
TEXAS INSTRUMENTS TFP410MPAPREP. 芯片, 数字发送器, 3.6V, HTQFP-64
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TFP410MPAPREP数据手册
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Texas Instruments, Inc. PCN# 20140926000
Qualification Report
.G700LB mold compound enterprise qualification for PowerPad QFP packages in TAI and
PHI sites
Approved 05/13/2014
Product Attributes
Attributes
Qual Device:
6964BDC0PAPG4
Qual Device:
ADS58C20IPFP
Qual Device:
D610A3BPYP225
Qual Device:
DRV593VFP_MSL1
Qual Device:
DRV593VFP_MSL2
Qual Device:
SLK2511CPZP
Assembly Site TAI PHI TAI TAI TAI TAI
Package Family HTQFP HTQFP HTQFP HLQFP HLQFP HTQFP
Flammability Rating UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0
Package Attributes
Qual Device:
6964BDC0PAPG4
Qual Device:
ADS58C20IPFP
Qual Device:
D610A3BPYP225
Qual Device:
DRV593VFP_MSL1
Qual Device:
DRV593VFP_MSL2
Qual Device:
SLK2511CPZP
Assembly Site TAI PHI TAI TAI TAI TAI
Package Family HTQFP HTQFP HTQFP HLQFP HLQFP HTQFP
Package
Designator
PAP PFP PYP VFP VFP PZP
Package Size
(mils)
393.7 X 393.7 472.44 X 472.44 1102.36 X 1102.36 275.59 X 275.59 275.59 X 275.59 393.7 X 393.7
Body Thickness
(mils)
39.37 39.37 55.12 55.12 55.12 39.37
Pin Count 64 80 208 32 32 100
Lead Frame
Material
Cu Cu Roughened Cu Cu Cu
Cu and Cu
Roughened
Lead Finish NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu
Lead Pitch (mils) 19.68 19.68 19.68 31.5 31.5 19.68
Mount Compound 4208458 4208458 4042504 4206201 4206201 4042504
Mold Compound 4211649 4211649 4211649 4211649 4211649 4211649
Bond Wire
Composition
Cu Au Au Cu Cu Cu, PCC
Bond Wire
Diameter (mils)
0.96 0.96 0.96 0.96 0.96 0.96, 1.0
Flammability Rating UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0
Oxide/Nitride
Passivation
SiON
Oxide/Nitride
Oxide/Nitride
Nitride
Nitride
C
Die Revision
BD
B
A
A
A
LBC3S
25C10
ANAM
Wafer Fab Process
LBC7
1833C05
1233C035.A6C
LBC3S
Wafer Fab Site
MIHO8
DMOS5
DMOS 5
HIJI
HIJI
- QBS: Qual By Similarity
- Qual Device qualified at LEVEL4-260CG: D610A3BPYP225
- Qual Devices qualified at LEVEL3-260CG: 6964BDC0PAPG4, ADS58C20IPFP, SLK2511CPZP, TLK2201BIRCP,
TUSB9260PVP, TVP70025IPZPR, TAS5707PHP, TVP5145PFP, TAS5631PHDR
- Qual Device qualified at LEVEL2-260CG:DRV593VFP
- Devices contain multiple dies: TAS5707PHP, TVP5145PFP
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