Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C5515AZCH10 数据手册 > TMS320C5515AZCH10 产品修订记录 3/9 页
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TMS320C5515AZCH10 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
LFBGA-196
描述:
TEXAS INSTRUMENTS TMS320C5515AZCH10 芯片, 数字信号处理器, 16位, 100MHZ, NFBGA-196
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TMS320C5515AZCH10数据手册
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Texas Instruments, Inc. PCN#20160602000
PCN Number:
20160602000
PCN Date:
06/06/2016
Title:
BGA Tray Change
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
09/01/2016
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of PEAK tray for the devices listed
under the Product Affected section. Tray comparison summary as follows:
Group 1 Device: 9x9mm BGA Tray
What
From
To
Stock #/Supplier
4204956-0001/OHKAWA
4209920-0001/KOSTAT
4222683-0001/PEAK
Matrix (Column x Rows)
10x26
10x26
Surface Resistivity, Ohms/Sq.
10⁵ to 10⁹
10⁵ to 10⁹
Raw Material
PPE / MPPO
MPPO
Tray Color
Black
Black
Temperature Rating
150 ⁰C
150 ⁰C
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