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CC2564MODACMOG 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
射频接收器
封装:
SMD-33
描述:
具有基本速率、增强数据速率和带集成天线的低功耗模块的 Bluetooth® 4.1 35-QFM -30 to 85
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P3P21P24P37
封装尺寸在P47P49P50
型号编码规则在P42
标记信息在P42P47P48
封装信息在P2P40P41P42P43P44P45P46P47P48P49P50
技术参数、封装参数在P9P10P11P12P13P14P15P16P17P18P19P20
应用领域在P1P37
电气规格在P11
导航目录
CC2564MODACMOG数据手册
Page:
of 52 Go
若手册格式错乱，请下载阅览PDF原文件
CC2560A NRND; CC2564 NRND
2
CC2560A, CC2560B, CC2564, CC2564B
SWRS121E –JULY 2012–REVISED JANUARY 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: CC2560A CC2560B CC2564 CC2564B
Device Overview Copyright © 2012–2016, Texas Instruments Incorporated
(1) For more information on these devices, see Section 9.2, Packaging and Ordering.
(2) NRND = Not recommended for new designs
1.3 Description
The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and
enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device
provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller
unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to
other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software
algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of
operation.
The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI's MSP430 and
ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI's third party. iPod
®
(MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode
Bluetooth Stack. Some of the profiles supported include the following:
• Serial port profile (SPP)
• Advanced audio distribution profile (A2DP)
• Audio/video remote control profile (AVRCP)
• Handsfree profile (HFP)
• Human interface device (HID)
• Generic attribute profile (GATT)
• Several Bluetooth LE profiles and services
In addition to software, this solution consists of multiple reference designs with a low BOM cost, including
a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end,
low-power audio solutions.
Device Information
(1)
PART NUMBER PACKAGE BODY SIZE
CC2560A (NRND)
(2)
RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
CC2560B RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
CC2564 (NRND)
(2)
RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
CC2564B RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
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