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PIC16F1713-I/SP
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PIC16F1713-I/SP数据手册
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2012 Microchip Technology Inc. DS41628B-page 5
3.7 Lesson 6: Debounce ............................................................................... 62
3.7.1 Introduction ............................................................................................ 62
3.7.2 Hardware Effects ................................................................................... 62
3.7.3 Summary ............................................................................................... 63
3.7.4 New Registers ....................................................................................... 63
3.7.5 New Instructions .................................................................................... 63
3.7.6 Assembly ............................................................................................... 63
3.7.7 PIC18 ..................................................................................................... 63
3.7.8 C Language ........................................................................................... 63
3.8 Lesson 7: Reversible Variable Speed Rotate ......................................... 64
3.8.1 Introduction ............................................................................................ 64
3.8.2 Hardware Effects ................................................................................... 64
3.8.3 Summary ............................................................................................... 64
3.8.4 New Registers ....................................................................................... 65
3.8.5 New Instructions .................................................................................... 65
3.8.6 Assembly ............................................................................................... 65
3.8.7 C Language ........................................................................................... 66
3.9 Lesson 8: Pulse-Width Modulation (PWM) ............................................. 67
3.9.1 Introduction ............................................................................................ 67
3.9.2 Hardware Effects ................................................................................... 67
3.9.3 Summary ............................................................................................... 67
3.9.4 New Registers ....................................................................................... 67
3.9.5 Assembly ............................................................................................... 70
3.10 Lesson 9: Timer0 .................................................................................... 71
3.10.1 Introduction ............................................................................................ 71
3.10.2 Hardware Effects ................................................................................... 71
3.10.3 Summary ............................................................................................... 71
3.10.4 New Registers ....................................................................................... 71
3.10.5 Assembly ............................................................................................... 72
3.10.6 C Language ........................................................................................... 72
3.11 Lesson 10: Interrupts and Pull-ups ......................................................... 73
3.11.1 Introduction ............................................................................................ 73
3.11.2 Hardware Effects ................................................................................... 73
3.11.3 Summary ............................................................................................... 73
3.11.4 New Registers ....................................................................................... 75
3.11.5 New Instructions .................................................................................... 76
3.11.6 Assembly ............................................................................................... 76
3.11.7 C Language ........................................................................................... 77
3.12 Lesson 11: Indirect Addressing .............................................................. 78
3.12.1 Introduction ............................................................................................ 78
3.12.2 Hardware Effects ................................................................................... 78
3.12.3 Summary ............................................................................................... 78
3.12.4 New Registers ....................................................................................... 80
3.12.5 New Instructions .................................................................................... 80
3.12.6 Assembly Language .............................................................................. 81
3.12.7 C language ............................................................................................ 82
3.13 Lesson 12: Look-up Table ..................................................................... 83
3.13.1 Intro ....................................................................................................... 83
3.13.2 Hardware Effects ................................................................................... 83
3.13.3 Summary ............................................................................................... 83

PIC16F1713-I/SP 数据手册

Microchip(微芯)
18 页 / 0.42 MByte
Microchip(微芯)
101 页 / 1.47 MByte
Microchip(微芯)
7 页 / 0.09 MByte
Microchip(微芯)
2 页 / 0.1 MByte

PIC16F1713 数据手册

Microchip(微芯)
PIC16F170x/171x,8 位闪存微控制器PIC16F170x/171x 微控制器结合了**智能模拟**与低成本和 **eXtreme** **低功率 (XLP)** 适合种类繁多的经济型通用应用。**智能模拟**:多达两个运算放大器,多达两个高速比较器,多达 28 个 10 位 ADC 输入通道和多达一个 5 位/8 位 DAC。 **可配置逻辑单元 (CLC)**:使用可配置逻辑单元模块创建自定义组合和顺序逻辑。 外部门和状态功能还可接入 MCU 自身。 **数字控制振荡器 (NCO)**:使用极细步骤可调频率输出。 NCO 提供高分辨率振荡器功能,用于例如照明镇流器、无线和语音生成器的控制应用程序。 **互补输出生成器 (COG)**:提供带上升和下降边缘死区控制的补充波形,无需高空处理器便可进行高效同步切换。 COG 还包括自动关闭和自动重启,可以直接与其他外围设备/外部输入连接。 此外,它还包括空白和相位控制。 **零交叉检测 (ZCD)**:交流高电压零交叉检测简化了三端双向可控硅开关元件控制,同步了切换控制和计时。 **外围引脚选择 (PPS)**:通过内部多路复用器将任何数字外围配置到任何引脚,确保布局灵活性和消除引脚重叠。
Microchip(微芯)
PIC16F1713-I/ML 管装
Microchip(微芯)
MICROCHIP  PIC16F1713-I/SP.  芯片, 微控制器, 8位, PIC16, 32MHZ, SPDIP-28
Microchip(微芯)
MICROCHIP  PIC16F1713-I/SS  微控制器, 8位, 闪存, AEC-Q100, PIC16F17xx, 32 MHz, 7 KB, 512 Byte, 28 引脚, SSOP
Microchip(微芯)
8位微控制器 -MCU 4K Flash 512B RAM Hi-Speed Comp 10bit
Microchip(微芯)
Microchip(微芯)
8位微控制器 -MCU 8 Bit MCU 7KB Flash 512B RAM ADC I2C/SPI
Microchip(微芯)
Microchip(微芯)
PIC 32MHz 闪存:4K@x14bit
Microchip(微芯)
PIC 32MHz 闪存:4K@x14bit
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