Datasheet 搜索 > 微控制器 > TI（德州仪器） > TMS320F28334ZJZQ 数据手册 > TMS320F28334ZJZQ 产品设计参考手册 4/199 页
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TMS320F28334ZJZQ 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
BGA-176
描述:
数字信号控制器（DSC ） Digital Signal Controllers (DSCs)
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P14P79P80Hot
典型应用电路图在P48P95
原理图在P33P58P65P73P75P78P87P94P97P100P106
封装尺寸在P189P190P191
标记信息在P189P190P191P192
封装信息在P11P12P13P189P190P191P192
技术参数、封装参数在P45P46P116P117P118P119P120P121P122P123P124P125
应用领域在P61P113P140P199
电气规格在P46P116P117P118P119P120P121P122P123P124P125P126
导航目录
TMS320F28334ZJZQ数据手册
Page:
of 199 Go
若手册格式错乱，请下载阅览PDF原文件
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
SPRS439M –JUNE 2007–REVISED AUGUST 2012
www.ti.com
6.14.7 External Interface Ready-on-Read Timing With One External Wait State ............................ 160
6.14.8 External Interface Ready-on-Write Timing With One External Wait State ............................. 163
6.14.9 XHOLD and XHOLDA Timing ............................................................................... 166
6.15 On-Chip Analog-to-Digital Converter .................................................................................. 169
6.15.1 ADC Power-Up Control Bit Timing .......................................................................... 170
6.15.2 Definitions ...................................................................................................... 171
6.15.3 Sequential Sampling Mode (Single-Channel) (SMODE = 0) ............................................ 172
6.15.4 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1) .......................................... 173
6.15.5 Detailed Descriptions ......................................................................................... 174
6.16 Multichannel Buffered Serial Port (McBSP) Timing ................................................................. 175
6.16.1 McBSP Transmit and Receive Timing ...................................................................... 175
6.16.2 McBSP as SPI Master or Slave Timing .................................................................... 178
6.17 Flash Timing .............................................................................................................. 182
6.18 Migrating Between F2833x Devices and F2823x Devices ......................................................... 184
7 L-to-M Revision History .................................................................................................... 185
8 K-to-L Revision History .................................................................................................... 186
9 Thermal and Mechanical Data ............................................................................................ 187
4 Contents Copyright © 2007–2012, Texas Instruments Incorporated
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