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XC6SLX25-3CSG324C 产品设计参考手册 - Xilinx（赛灵思）
制造商:
Xilinx（赛灵思）
分类:
FPGA芯片
封装:
LFBGA-324
描述:
FPGA, Spartan-6, DCM, PLL, 226 I/O, 400 MHz, 24051单元, 1.14 V至1.26 V, CSBGA-324
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P7P8P9P10Hot
原理图在P7
功能描述在P5
应用领域在P5P16
导航目录
XC6SLX25-3CSG324C数据手册
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若手册格式错乱，请下载阅览PDF原文件
2
SWRU493A–November 2016–Revised November 2016
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Copyright © 2016, Texas Instruments Incorporated
Table of Contents
Contents
1 Introduction to the CC256xCQFN-EM Board............................................................................ 4
1.1 Key Features.............................................................................................................. 5
1.2 QFN EM Board Applications............................................................................................ 5
2 Module Description .............................................................................................................. 6
3 Module Detailed Description.................................................................................................. 7
3.1 Pin Description ........................................................................................................... 7
3.1.1 Board Jumpers................................................................................................ 7
3.1.1.1 Measuring Current Consumption ...................................................................... 7
3.1.2 Antenna and U.FL Selector ................................................................................. 7
3.1.3 RF Connectors................................................................................................ 8
3.1.4 Debug Header ................................................................................................ 9
3.1.5 COM Connector............................................................................................. 10
3.2 Clock Inputs ............................................................................................................. 12
4 Module Dimensions............................................................................................................ 12
5 Tools and Software............................................................................................................. 13
5.1 TI's Bluetooth
®
Software Solution..................................................................................... 13
5.2 Evaluation Platforms ................................................................................................... 13
5.3 Bluetooth
®
Hardware Evaluation Tool................................................................................ 13
6 Certification....................................................................................................................... 14
7 Life Support Policy............................................................................................................. 14
8 Related Documents ............................................................................................................ 14
Revision History.......................................................................................................................... 15
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