Datasheet 搜索 > FPGA芯片 > Xilinx（赛灵思） > XC6SLX25-3CSG324C 数据手册 > XC6SLX25-3CSG324C 产品设计参考手册 6/16 页
器件3D模型￥ 83.387
XC6SLX25-3CSG324C 产品设计参考手册 - Xilinx（赛灵思）
制造商:
Xilinx（赛灵思）
分类:
FPGA芯片
封装:
LFBGA-324
描述:
FPGA, Spartan-6, DCM, PLL, 226 I/O, 400 MHz, 24051单元, 1.14 V至1.26 V, CSBGA-324
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应用领域在P5P16
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XC6SLX25-3CSG324C数据手册
Page:
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若手册格式错乱，请下载阅览PDF原文件
U.FL
Connector
QFN
Reference Design
Debug
Header Pin 1
COM Connector
VDD_IO
Jumper 1
PCB
Copper
Antenna
17
18
15
16
13
14
12
11
10
9
8
7
6
5
4
3
1
VBAT
Jumper 2
Text
Module Description
www.ti.com
6
SWRU493A–November 2016–Revised November 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
CC256xCQFN-EM
2 Module Description
The CC256xC QFN EM board is the development environment for the CC256x family and plugs into TI's
MSP432™ LaunchPad™ through the BOOST-CCEMADAPTER board.
This family is based on TI's CC256xC integrated circuit and uses a host controller interface (HCI), a cost-
effective and flexible means for implementing a Bluetooth network. The HCI reduces BOM cost by
eliminating redundant processing capacity and gives designers the flexibility to work with a controller of
their choice, because the Bluetooth stack resides and executes on the host processor of the application.
Figure 2 highlights various aspects of the CC256xCQFN-EM board.
Figure 2. CC2564xCQFN-EM Highlights
The CC256xCQFN-EM board is intended for evaluation purposes and works with TI's Hardware
Development Kit. See Section 6 for more information.
To help implement this reference design, schematics and layout files are available on the CC256x Main
Wiki page.
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