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CSD87333Q3DT 其他数据使用手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
晶体管
封装:
PowerTDFN-8
描述:
30V、N 沟道同步降压 NexFET MOSFET™、SON3x3 电源块、15A 8-VSON-CLIP -55 to 150
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P9
封装尺寸在P14P18P20P21
焊盘布局在P16
标记信息在P18
封装信息在P1P14P17P18P19P20P21
技术参数、封装参数在P3
应用领域在P1P5P6P9
电气规格在P4
导航目录
CSD87333Q3DT数据手册
Page:
of 22 Go
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2
CSD87333Q3D
SLPS350A –FEBRUARY 2014–REVISED JANUARY 2017
www.ti.com
Product Folder Links: CSD87333Q3D
Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Specifications......................................................... 3
5.1 Absolute Maximum Ratings...................................... 3
5.2 Recommended Operating Conditions....................... 3
5.3 Power Block Performance ........................................ 3
5.4 Thermal Information.................................................. 3
5.5 Electrical Characteristics........................................... 4
5.6 Typical Power Block Device Characteristics............. 5
5.7 Typical Power Block MOSFET Characteristics......... 7
6 Applications ........................................................... 9
6.1 Power Loss Curves................................................... 9
6.2 Safe Operating Area (SOA) Curves.......................... 9
6.3 Normalized Curves.................................................... 9
6.4 Calculating Power Loss and SOA........................... 10
7 Recommended PCB Design Overview .............. 11
7.1 Electrical Performance............................................ 11
7.1 Thermal Performance ............................................. 12
8 Device and Documentation Support.................. 13
8.1 Receiving Notification of Documentation Updates.. 13
8.2 Community Resources............................................ 13
8.3 Trademarks............................................................. 13
8.4 Electrostatic Discharge Caution.............................. 13
8.5 Glossary.................................................................. 13
9 Mechanical, Packaging, and Orderable
Information........................................................... 14
9.1 Q3D Package Dimensions...................................... 14
9.2 Pinout Configuration................................................ 15
9.3 Land Pattern Recommendation.............................. 16
9.4 Stencil Recommendation........................................ 16
9.5 Q3D Tape and Reel Information............................. 17
4 Revision History
Changes from Original (February 2014) to Revision A Page
• Added pulse duration note to I
DM
in the Absolute Maximum Ratings table............................................................................ 3
• Added Receiving Notification of Documentation Updates section and Community Resources section to the Device
and Documentation Support section .................................................................................................................................... 13
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