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DRV5023BIQLPGMQ1 其他数据使用手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
地磁传感器
封装:
TO-92-3
描述:
汽车类 2.7V 至 38V 霍尔效应单极开关 3-TO-92 -40 to 125
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P22P23
原理图在P9
封装尺寸在P27P29P30
焊盘布局在P25
标记信息在P27
封装信息在P27P28P29P30
技术参数、封装参数在P4
电气规格在P5P6
导航目录
DRV5023BIQLPGMQ1数据手册
Page:
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若手册格式错乱,请下载阅览PDF原文件

2
DRV8846
ZHCSG92A –JUNE 2014–REVISED MARCH 2017
www.ti.com.cn
Copyright © 2014–2017, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements................................................ 6
6.7 Typical Characteristics.............................................. 7
7 Detailed Description.............................................. 8
7.1 Overview................................................................... 8
7.2 Functional Block Diagram......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 21
8 Application and Implementation ........................ 22
8.1 Application Information............................................ 22
8.2 Typical Application ................................................. 22
9 Power Supply Recommendations...................... 25
10 Layout................................................................... 25
10.1 Layout Guidelines ................................................. 25
10.2 Layout Example .................................................... 25
11 器器件件和和文文档档支支持持 ..................................................... 26
11.1 文档支持................................................................ 26
11.2 接收文档更新通知 ................................................. 26
11.3 社区资源................................................................ 26
11.4 商标 ....................................................................... 26
11.5 静电放电警告......................................................... 26
11.6 Glossary................................................................ 26
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 26
4 修修订订历历史史记记录录
注:之前版本的页码可能与当前版本有所不同。
Changes from Original (June 2014) to Revision A Page
• 已更改 将自适应衰减更改为 AutoTune................................................................................................................................... 1
• 更新了
说明
............................................................................................................................................................................. 1
• Changed Handling Ratings table to an ESD Ratings table and moved T
stg
to Absolute Maximum Ratings ........................ 4
• Changed references of rms current to full-scale current and changed the maximum current from 1 to 1.4 A
throughout the document........................................................................................................................................................ 4
• Updated the R
DS(ON)
units and V
HYS
in the Electrical Characteristics..................................................................................... 5
• Changed changed the nENBL setting from 0 to 1 in the Micro-Stepping Indexer section................................................... 10
• Added more information regarding the ADEC pin ............................................................................................................... 18
• Updated the Device Functional Modes ............................................................................................................................... 21
• 已添加
文档支持
、
接收文档更新通知
以及
社区资源
部分 .................................................................................................... 26
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