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器件3D模型￥ 27.073
DSPIC30F2010-30I/SP 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
dsPIC30 系列 512 B RAM 12 kB 闪存 16位 数字信号控制器 - SDIP-28
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P97Hot
原理图在P8P16P55P60P64P65P69P73P77P84P94P98
标记信息在P189
封装信息在P189P201
功能描述在P93P97
技术参数、封装参数在P115P116P150P156P157P159P161P183P184
电气规格在P59P63P115P116P158
导航目录
DSPIC30F2010-30I/SP数据手册
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dsPIC30F2010
DS70118D-page 4 Preliminary 2004 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 5
2.0 CPU Architecture Overview.......................................................................................................................................................... 9
3.0 Memory Organization ................................................................................................................................................................. 19
4.0 Address Generator Units............................................................................................................................................................ 31
5.0 Interrupts .................................................................................................................................................................................... 37
6.0 Flash Program Memory.............................................................................................................................................................. 43
7.0 Data EEPROM Memory ............................................................................................................................................................. 49
8.0 I/O Ports ..................................................................................................................................................................................... 53
9.0 Timer1 Module ........................................................................................................................................................................... 57
10.0 Timer2/3 Module ........................................................................................................................................................................ 61
11.0 Input Capture Module ................................................................................................................................................................. 67
12.0 Output Compare Module ............................................................................................................................................................ 71
13.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 75
14.0 Motor Control PWM Module ....................................................................................................................................................... 81
15.0 SPI™ Module ............................................................................................................................................................................. 91
16.0 I2C Module ................................................................................................................................................................................. 95
17.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 103
18.0 10-bit High Speed Analog-to-Digital Converter (A/D) Module .................................................................................................. 111
19.0 System Integration ................................................................................................................................................................... 119
20.0 Instruction Set Summary .......................................................................................................................................................... 133
21.0 Development Support............................................................................................................................................................... 141
22.0 Electrical Characteristics .......................................................................................................................................................... 147
23.0 Packaging Information.............................................................................................................................................................. 187
On-Line Support................................................................................................................................................................................. 197
Systems Information and Upgrade Hot Line ...................................................................................................................................... 197
Reader Response .............................................................................................................................................................................. 198
Product Identification System............................................................................................................................................................. 199
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