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PC817X3NIP1B 其他数据使用手册 - Sharp(夏普)
制造商:
Sharp(夏普)
封装:
SMD-4
描述:
PC817X3NIP1B 编带
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P5
标记信息在P9
技术参数、封装参数在P6
电气规格在P6P9
导航目录
PC817X3NIP1B数据手册
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PC817X*NIP1B
3/10
6.7 ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFC
S
, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform)
6.8 Specified brominated flame retardants
Specified brominated flame retardants (PBB and PBDE) are not used in this device at all
6.9 Compliance with each regulation
(1) The RoHS directive(2011/65/EU)
This product complies with the RoHS directive(2011/65/EU) .
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls(PBB)
and polybrominated diphenyl ethers(PBDE)
(2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic
Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Marking Styles for the Names and Contents of the Hazardous Substances
Category
Hazardous Substances
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
chromium
(Cr
6+
)
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
Photocoupler
○ ○ ○ ○ ○ ○
This table is prepared in accordance with the provisions of SJ/T 11364.
○:Indicates that said hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement of GB/T 26572
7. Notes
Precautions for photocouplers : Attachment-1
REFERENCE
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