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TIP32C
1.034
导航目录
  • 封装尺寸在P22
  • 标记信息在P7
  • 应用领域在P25
  • 型号编号列表在P2P19
TIP32C数据手册
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PCN IPD/13/7945 - Dated 18 Jun 2013
Table 1. Change Implementation Schedule
Forecasted implementation date for 10-Sep-2013
change
Forecasted availability date of samples 11-Jun-2013
for customer
Forecasted date for STMicroelectronics
change Qualification Plan results availability 11-Jun-2013
Estimated date of changed product first 17-Sep-2013
shipment
Table 2. Change Identification
Product Identification see attached list
(Product Family/Commercial Product)
Type of change Assembly additional location
Reason for change To improve service to ST Customers
Description of the change To respond the ever increasing demand for the products housed in
TO-220 package, ST is glad to announce the expansion of capacity at
Nantong Fujitsu Microelectronics (China) Subcontractor factory, For
the complete list of the part numbers affected by this change, please
refer to the attached Products List
Change Product Identification will be ensured by the first two digits of the traceability code
("GF")
Manufacturing Location(s)
®
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