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器件3D模型￥ 8.166
TMP108AIYFFR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
DSBGA-6
描述:
低功耗数字温度传感器，在WCSP两线串行接口 Low Power Digital Temperature Sensor With Two-Wire Serial Interface in WCSP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P10Hot
典型应用电路图在P19P20
原理图在P7
封装尺寸在P1P24P26P27
标记信息在P24
封装信息在P24P25P26P27
技术参数、封装参数在P4
应用领域在P20
电气规格在P5
导航目录
TMP108AIYFFR数据手册
Page:
of 32 Go
若手册格式错乱，请下载阅览PDF原文件
TMP75B
ZHCSCD2B –APRIL 2014–REVISED AUGUST 2014
www.ti.com.cn
目目录录
7.4 Device Functional Modes........................................ 15
1 特特性性.......................................................................... 1
7.5 Programming........................................................... 16
2 应应用用范范围围................................................................... 1
7.6 Register Map........................................................... 16
3 说说明明.......................................................................... 1
8 Application and Implementation ........................ 19
4 修修订订历历史史记记录录 ........................................................... 2
8.1 Application Information............................................ 19
5 Pin Configuration and Functions......................... 3
8.2 Typical Application ................................................. 19
6 Specifications......................................................... 4
9 Power Supply Recommendations...................... 20
6.1 Absolute Maximum Ratings...................................... 4
10 Layout................................................................... 21
6.2 Handling Ratings....................................................... 4
10.1 Layout Guidelines ................................................. 21
6.3 Recommended Operating Conditions....................... 4
10.2 Layout Example .................................................... 21
6.4 Thermal Information.................................................. 4
11 器器件件和和文文档档支支持持 ..................................................... 22
6.5 Electrical Characteristics........................................... 5
11.1 文档支持 ............................................................... 22
6.6 Typical Characteristics.............................................. 6
11.2 商标 ....................................................................... 22
7 Detailed Description.............................................. 7
11.3 静电放电警告......................................................... 22
7.1 Overview................................................................... 7
11.4 术语表 ................................................................... 22
7.2 Functional Block Diagram......................................... 7
12 机机械械封封装装和和可可订订购购信信息息 .......................................... 22
7.3 Feature Description................................................... 8
4 修修订订历历史史记记录录
Changes from Revision A (April 2014) to Revision B Page
Changes from Original (April 2014) to Revision A Page
• 数据表中增加了 DGK (VSSOP-8) 封装 ................................................................................................................................. 1
• 从产品预览更改为生产数据..................................................................................................................................................... 1
2 Copyright © 2014, Texas Instruments Incorporated
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