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器件3D模型￥ 8.165
TMP108AIYFFR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
DSBGA-6
描述:
低功耗数字温度传感器，在WCSP两线串行接口 Low Power Digital Temperature Sensor With Two-Wire Serial Interface in WCSP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P10Hot
典型应用电路图在P19P20
原理图在P7
封装尺寸在P1P24P26P27
标记信息在P24
封装信息在P24P25P26P27
技术参数、封装参数在P4
应用领域在P20
电气规格在P5
导航目录
TMP108AIYFFR数据手册
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若手册格式错乱，请下载阅览PDF原文件
TMP75B
ZHCSCD2B –APRIL 2014–REVISED AUGUST 2014
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage, V
S
4 V
SDA, SCL, ALERT, A2, A1 -0.3 4 V
Input voltage
A0 -0.3 (V
S
) + 0.3 V
Sink current SDA, ALERT 10 mA
Operating junction temperature -55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range -60 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
–2000 2000
Electrostatic
V
(ESD)
V
discharge
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
(2)
–1000 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 1.4 1.8 3.6 V
Operating free-air temperature, T
A
-55 125 °C
6.4 Thermal Information
TMP75B
THERMAL METRIC
(1)
D (SOIC) DGK (VSSOP) UNIT
8 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance 125.4 188.1
R
θJC(top)
Junction-to-case (top) thermal resistance 71.5 79.1
R
θJB
Junction-to-board thermal resistance 65.8 109.6
°C/W
ψ
JT
Junction-to-top characterization parameter 21.1 15.3
ψ
JB
Junction-to-board characterization parameter 65.3 108
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Copyright © 2014, Texas Instruments Incorporated
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