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TMP302CDRLT 产品封装文件 - TI（德州仪器）

制造商:

TI（德州仪器）

分类:

温度传感器

封装:

SOT-553-6

描述:

TEXAS INSTRUMENTS TMP302CDRLT 温度传感器芯片, 漏极开路, ± 0.2°C, -40 °C, +125 °C, SOT-23, 6 引脚

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

引脚图在P3Hot

典型应用电路图在P10P11P12

原理图在P8P10P11

封装尺寸在P15P17P18

标记信息在P15P16

封装信息在P14P15P16P17P18

技术参数、封装参数在P4

应用领域在P1

电气规格在P5

导航目录

引脚图在P3
典型应用电路图在P10 P11 P12
原理图在P8 P10 P11
封装尺寸在P15 P17 P18
标记信息在P15 P16
封装信息在P14 P15 P16 P17 P18
技术参数、封装参数在P4
应用领域在P1
电气规格在P5

TMP302CDRLT数据手册

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TMP302

SBOS488C –JUNE 2009–REVISED AUGUST 2015

www.ti.com

Table of Contents

7.3 Feature Description................................................... 9

1 Features.................................................................. 1

7.4 Device Functional Modes.......................................... 9

2 Applications ........................................................... 1

8 Application and Implementation ........................ 10

3 Description............................................................. 1

8.1 Application Information............................................ 10

4 Revision History..................................................... 2

8.2 Typical Application ................................................. 10

5 Pin Configuration and Functions......................... 3

9 Power Supply Recommendations...................... 13

6 Specifications......................................................... 4

10 Layout................................................................... 13

6.1 Absolute Maximum Ratings ...................................... 4

10.1 Layout Guidelines ................................................. 13

6.2 ESD Ratings.............................................................. 4

10.2 Layout Example .................................................... 13

6.3 Recommended Operating Conditions....................... 4

11 Device and Documentation Support................. 14

6.4 Thermal Information.................................................. 4

11.1 Community Resources.......................................... 14

6.5 Electrical Characteristics........................................... 5

11.2 Trademarks........................................................... 14

6.6 Typical Characteristics.............................................. 6

11.3 Electrostatic Discharge Caution............................ 14

7 Detailed Description.............................................. 8

11.4 Glossary................................................................ 14

7.1 Overview................................................................... 8

12 Mechanical, Packaging, and Orderable

7.2 Functional Block Diagram......................................... 8

Information........................................................... 14

4 Revision History

Changes from Revision B (December 2014) to Revision C Page

• Changed device names by simplifying from TMP302A, TMP302B, TMP302C, and TMP302D to TMP302 ......................... 1

• Added plus-minus symbol to Machine Model value in ESD Ratings table............................................................................. 4

• Moved Specified Operating Temperature parameter from Electrical Characteristics table to Recommended

Operating Conditions table..................................................................................................................................................... 4

• Added Community Resources section ................................................................................................................................. 14

Changes from Revision A (September 2009) to Revision B Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 4