Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C6748BZCEA3 数据手册 > TMS320C6748BZCEA3 产品修订记录 1/7 页
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TMS320C6748BZCEA3 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
NFBGA-361
描述:
TMS320C6748定点和浮点DSP TMS320C6748 Fixed- and Floating-Point DSP
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3D模型
符号图
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引脚图
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TMS320C6748BZCEA3数据手册
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Texas Instruments, Inc. PCN# 20140130001B
PCN Number:
20140130001B
PCN Date:
06/23/2014
Title:
Hybrid Au/Cu wire bond flow for NFBGA Shiva and Freon Devices
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Proposed 1
st
Ship Date:
09/23/2014
Estimated Sample
Availability:
Date provided at sample
request.
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
The purpose of Revision B is to communicate a design revision change and part number change for
the Freon devices listed in the Product Affected Section of this document. Previous sample
requests will be built with the new design revision and the new part number.
Design Change:
Description of Design Change
Benefit of Change
Increased the range of the
temperature compensation DAC.
Improved USB performance over
temperature.
This is to Qualify a Hybrid Au/Cu wire bond flow for NFBGA Shiva and Freon Devices. See table
below for reference:
Material Set
From
To
Wire diam (Mils)
0.8mil Au wire
0.8mil Au/Cu wire
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None.
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