Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C6748BZCEA3 数据手册 > TMS320C6748BZCEA3 产品修订记录 5/7 页
器件3D模型￥ 13.908
TMS320C6748BZCEA3 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
NFBGA-361
描述:
TMS320C6748定点和浮点DSP TMS320C6748 Fixed- and Floating-Point DSP
Pictures:
3D模型
符号图
焊盘图
引脚图
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TMS320C6748BZCEA3数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20140130001B
- QBS: Qual By Similarity
- Qual Device AM1808BZCE4_PG2.3 is qualified at LEVEL3-260C
- Qual Device OMAPL138BZWTQ3_PG2.3 is qualified at LEVEL3-260C
- Qual Device TMS320C6748BZWTA3E_PG2.1 is qualified at LEVEL3-260C
Qualification Results
Data Displayed as: Number of lots / Total sample size / Total failed
Type
#
Test Name /
Condition
Duration
Qual Device:
AM1808BZCE4_PG2.3
Qual Device:
OMAPL138BZWTQ3_PG2.3
Qual Device:
TMS320C6748BZWTA3E_PG2.1
Test Group A - Accelerated
Environment Stress Test
PC
A1
Preconditioning
Level3-260C
-
-
Performed on ALL SMD devices prior to
THB/HAST, AC/UHST, TC and PTC
THB
A2
Biased
Temperature
and Humidity,
85C/85%RH
1000 hours
-
-
3/78/0
UHAST
A3
Unbiased HAST
110C/85%RH
264 hours
-
-
3/231/0
TC
A4
Temperature
Cycle, -55/125C
1000 cycles
-
-
3/231/0
HTSL
A6
High Temp
Storage Bake
150C
1000 hours
-
-
3/231/0
Test Group C - Package Assembly
Integrity Tests
WBS
C1
Wire Bond
Shear (Ppk >
1.67 and Cpk >
1.33)
30 Bonds / 5
Parts
Minimum
-
-
3 / Pass
WBP
C2
Wire Bond Pull
(Ppk > 1.67 and
Cpk > 1.33)
30 Bonds / 5
Parts
Minimum
-
-
3 / Pass
Test Group E - Electrical Verification
CDM
E3
ESD - CDM
(JEDEC)
+/-250V
1/3/0
-
-
CDM
E3
ESD - CDM
(JEDEC)
+/-500V
1/3/0
-
-
CDM
E3
ESD - CDM
(JEDEC)
+/-750V
1/3/0
-
-
CDM
E3
ESD - CDM -
Q100
+/-750V
(corner BGA)
-
1/3/0
-
CDM
E3
ESD - CDM -
Q100
+/-250V
-
1/3/0
-
CDM
E3
ESD - CDM -
Q100
+/-500V
-
1/3/0
-
ED
E5
Electrical
Characterization.
PLL
frequency
shift eval on
ATE
1 / Pass
-
-
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