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MCIMX287CVM4C 产品设计参考手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
封装:
MAPBGA-289
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MCIMX287CVM4C数据手册
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i.MX28 Layout and Design Guidelines, Rev. 0
4 Freescale Semiconductor
PMU and DC-DC Converter
• Make sure the DCDC_GND pin has a good low impedance connection to the other i.MX28 ground
pins. If a voltage difference is created between the DCDC_GND pin and the other i.MX28 VSS
pins, the system may be more susceptible to ESD failure.
• The power inductor traces should be 15-20 mils thick and should not use vias. If for some reason
the power inductor cannot be placed on the same side of the PCB as the i.MX28, then multiple vias
should be used to connect the inductor to the i.MX28 DC-DC converter pins.
• All vias used for the i.MX28 PMU power (VDD) and ground (VSS) pins, including the
DCDC_GND pin, should have a drill hole size of 8 mils or larger to ensure a low
impedance/inductive path between the pin and the PCB power/ground plane.
3.2 Minimize Switching Current Loops
The DCDC converter switching current loop area should be kept as small as possible to reduce the radiated
emissions. There are two switching current loops as shown below. LOOP1: This occurs during the portion
of the duty cycle when the inductor is being charged. LOOP2: This occurs during the flyback portion of
the duty cycle when the inductor is supplying all of the current to the load.
Minimizing the current loop areas can be accomplished by making sure the following layout rules are
followed:
• Place the DCDC_BATT pin input capacitors as close as possible to the DCDC_BATT pin (less than
5mm away).
• Place the DCDC inductor as close as possible to the DCDC_LP and DCDC_LN pins.
• Route the inductor traces close together.
DCDC_BATT
DCDC_GND
DCDC_LP
DCDC_LN1
DCDC_VDDIO
VDDIO
BATTERY
i.MX
LOOP1
DCDC_BATT
DCDC_GND
DCDC_LP
DCDC_LN1
DCDC_VDDIO
VDDIO
BATTERY
i.MX
LOOP2
Current loop during
inductor charging.
Current loop during
inductor discharge.
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