Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C6421ZDUQ5 数据手册 > TMS320C6421ZDUQ5 产品设计参考手册 5/222 页
器件3D模型￥ 45.66
TMS320C6421ZDUQ5 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
BGA-376
描述:
数字信号处理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P16P29P33P74P75P77P79P84P85P86P90P91Hot
原理图在P4P107P108P117P118P166P184
封装尺寸在P218
标记信息在P218P219
封装信息在P217P218P219
技术参数、封装参数在P109P113P114P115P116P117P118P119P120P121P122P123
应用领域在P2P110
电气规格在P106P111P112P113P114P115P116P117P118P119P120P121
导航目录
TMS320C6421ZDUQ5数据手册
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Contents
TMS320C6421
Fixed-Point Digital Signal Processor
www.ti.com
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
Ranges of Supply Voltage and Operating
1 TMS320C6421 Fixed-Point Digital Signal
Temperature (Unless Otherwise Noted) ........... 111
Processor .................................................. 1
6 Peripheral Information and Electrical
1.1 Features .............................................. 1
Specifications ......................................... 113
1.2 Description ............................................ 2
6.1 Parameter Information ............................. 113
1.3 Functional Block Diagram ............................ 4
6.2 Recommended Clock and Control Signal Transition
Revision History ............................................... 6
Behavior ............................................ 114
2 Device Overview ......................................... 7
6.3 Power Supplies .................................... 114
2.1 Device Characteristics ................................ 7
6.4 Enhanced Direct Memory Access (EDMA3)
2.2 C64x+ Megamodule .................................. 8
Controller ........................................... 122
2.3 Memory Map Summary ............................. 14
6.5 Reset ............................................... 135
2.4 Pin Assignments .................................... 16
6.6 External Clock Input From MXI/CLKIN Pin ........ 144
2.5 Terminal Functions .................................. 24
6.7 Clock PLLs ......................................... 146
2.6 Device Support ...................................... 56
6.8 Interrupts ........................................... 152
2.7 Device and Development-Support Tool
6.9 External Memory Interface (EMIF) ................. 155
Nomenclature ....................................... 56
6.10 Universal Asynchronous Receiver/Transmitter
2.8 Documentation Support ............................. 58
(UART) ............................................. 163
3 Device Configurations ................................. 59
6.11 Inter-Integrated Circuit (I2C) ....................... 166
3.1 System Module Registers ........................... 59
6.12 Host-Port Interface (HPI) Peripheral ............... 170
3.2 Power Considerations ............................... 60
6.13 Multichannel Buffered Serial Port (McBSP) ........ 175
3.3 Clock Considerations ................................ 62
6.14 Multichannel Audio Serial Port (McASP0)
Peripheral .......................................... 183
3.4 Boot Sequence ...................................... 64
6.15 Ethernet Media Access Controller (EMAC) ........ 191
3.5 Configurations At Reset ............................. 73
6.16 Management Data Input/Output (MDIO) .......... 200
3.6 Configurations After Reset .......................... 75
6.17 Timers .............................................. 202
3.7 Multiplexed Pin Configurations ...................... 79
6.18 Pulse Width Modulator (PWM) ..................... 204
3.8 Device Initialization Sequence After Reset ........ 103
6.19 VLYNQ ............................................. 206
3.9 Debugging Considerations ......................... 105
6.20 General-Purpose Input/Output (GPIO) ............. 210
4 System Interconnect ................................. 107
6.21 IEEE 1149.1 JTAG ................................. 214
4.1 System Interconnect Block Diagram ............... 107
7 Mechanical Data ....................................... 216
5 Device Operating Conditions ....................... 109
7.1 Thermal Data for ZWT ............................. 216
5.1 Absolute Maximum Ratings Over Operating
Temperature Range (Unless Otherwise Noted) ... 109
7.1.1 Thermal Data for ZDU ............................. 217
5.2 Recommended Operating Conditions ............. 110
7.1.2 Packaging Information ............................. 217
5.3 Electrical Characteristics Over Recommended
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