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器件3D模型￥ 13.73
JS28F320J3F75E 其他数据使用手册 - Micron（镁光）
制造商:
Micron（镁光）
分类:
Flash芯片
封装:
TSOP-56
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P9Hot
典型应用电路图在P148
原理图在P90P91P92P93P95P111P116P125P129P137P146P167
封装尺寸在P205P206
标记信息在P205P206
封装信息在P14P205P206P207
功能描述在P201
技术参数、封装参数在P46P47P48P49P50P51P52P53P54P55P56P57
应用领域在P37P115P127P197P198
电气规格在P47P62P63P64P105P108P109P112P132P167
导航目录
JS28F320J3F75E数据手册
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5
TMS320F28379D
,
TMS320F28377D
TMS320F28376D, TMS320F28375D, TMS320F28374D
www.ti.com.cn
ZHCSC63F –DECEMBER 2013–REVISED NOVEMBER 2015
内容
版权 © 2013–2015, Texas Instruments Incorporated
内内容容
1 器器件件概概述述 .................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 2
1.3 说明 ................................................... 2
1.4 功能框图 ............................................. 4
2 修修订订历历史史记记录录............................................... 6
3 Device Comparison ..................................... 7
4 Terminal Configuration and Functions.............. 9
4.1 Pin Diagrams ......................................... 9
4.2 Signal Descriptions.................................. 15
4.3 Pins With Internal Pullup and Pulldown............. 37
4.4 Connections for Unused Pins ....................... 38
4.5 Pin Multiplexing...................................... 39
5 Specifications........................................... 46
5.1 Absolute Maximum Ratings ........................ 46
5.2 ESD Ratings ........................................ 46
5.3 Recommended Operating Conditions............... 47
5.4 Electrical Characteristics............................ 47
5.5 Power Consumption Summary...................... 48
5.6 Thermal Resistance Characteristics ................ 52
5.7 System .............................................. 54
5.8 Analog Peripherals .................................. 90
5.9 Control Peripherals ................................ 115
5.10 Communications Peripherals ...................... 132
6 Detailed Description.................................. 174
6.1 Overview........................................... 174
6.2 Functional Block Diagram ......................... 174
6.3 Memory ............................................ 176
6.4 Identification........................................ 184
6.5 Bus Architecture – Peripheral Connectivity........ 185
6.6 C28x Processor.................................... 186
6.7 Control Law Accelerator ........................... 188
6.8 Direct Memory Access............................. 189
6.9 Interprocessor Communication Module............ 191
6.10 Boot ROM and Peripheral Booting................. 192
6.11 Dual Code Security Module ....................... 195
6.12 Timers.............................................. 195
6.13 Nonmaskable Interrupt With Watchdog Timer
(NMIWD) ........................................... 195
6.14 Watchdog .......................................... 196
6.15 Configurable Logic Block (CLB) ................... 196
7 Applications, Implementation, and Layout...... 197
7.1 TI Design or Reference Design.................... 197
7.2 Development Tools ................................ 198
7.3 Software Tools ..................................... 198
7.4 Training ............................................ 198
8 器器件件和和文文档档支支持持......................................... 199
8.1 器件支持 ........................................... 199
8.2 文档支持 ........................................... 201
8.3 相关链接 ........................................... 202
8.4 社区资源 ........................................... 202
8.5 商标 ................................................ 202
8.6 静电放电警告....................................... 202
8.7 Glossary............................................ 202
9 机机械械、、封封装装和和可可订订购购信信息息 .............................. 203
9.1 封装信息 ........................................... 203
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