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MJD44H11G
3.219
导航目录
  • 封装尺寸在P8P9
  • 焊盘布局在P8
  • 型号编码规则在P1P7P9
  • 标记信息在P1P9
  • 封装信息在P7
  • 技术参数、封装参数在P7
  • 应用领域在P1
  • 电气规格在P3
MJD44H11G数据手册
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MJD44H11, NJVMJD44H11 (NPN), MJD45H11, NJVMJD45H11 (PNP)
http://onsemi.com
2
MAXIMUM RATINGS (T
A
= 25_C, common for NPN and PNP, minus sign, “”, for PNP omitted, unless otherwise noted)
Rating
Symbol Max Unit
CollectorEmitter Voltage V
CEO
80 Vdc
EmitterBase Voltage V
EB
5 Vdc
Collector Current Continuous
Peak
I
C
8
16
Adc
Total Power Dissipation
@ T
C
= 25°C
Derate above 25°C
P
D
20
0.16
W
W/°C
Total Power Dissipation (Note 1)
@ T
A
= 25°C
Derate above 25°C
P
D
1.75
0.014
W
W/°C
Operating and Storage Junction
Temperature Range
T
J
, T
stg
55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, JunctiontoCase
R
q
JC
6.25 °C/W
Thermal Resistance, JunctiontoAmbient (Note 1)
R
q
JA
71.4 °C/W
Lead Temperature for Soldering T
L
260 °C
1. These ratings are applicable when surface mounted on the minimum pad sizes recommended.

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