Datasheet 搜索 > FET驱动器 > TI（德州仪器） > UCC27424DGNRG4 数据手册 > UCC27424DGNRG4 其他数据使用手册 1/34 页
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UCC27424DGNRG4 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
FET驱动器
封装:
PowerPad-MSOP-8
描述:
双4 -A高速低侧MOSFET驱动器与启用 Dual 4-A High Speed Low-Side MOSFET Drivers With Enable
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P14P15P16P17P18
原理图在P12
封装尺寸在P23P24P26P27
标记信息在P23P24P25
封装信息在P22P23P24P25P26P27
功能描述在P12
技术参数、封装参数在P4
应用领域在P1P25P34
电气规格在P5
导航目录
UCC27424DGNRG4数据手册
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8
7
6
5
1
2
3
4
GND
GND
GND
UCC2742x
ENBA
ENBB
INA
INB
V+
ENBA
INA
GND
INB
ENBB
OUTA
VDD
OUTB
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UCC27423
,
UCC27424
,
UCC27425
SLUS545E –NOVEMBER 2002–REVISED DECEMBER 2015
UCC2742x Dual 4-A High Speed Low-Side MOSFET Drivers With Enable
1 Features 3 Description
The UCC2742x family of high-speed dual MOSFET
1
• Industry-Standard Pin-Out
drivers can deliver large peak currents into capacitive
• Enable Functions for Each Driver
loads. Three standard logic options are offered –
• High Current Drive Capability of ±4 A
dual-inverting, dual-noninverting, and one-inverting
and one-noninverting driver. The thermally enhanced
• Unique BiPolar and CMOS True Drive Output
8-pin PowerPAD™ MSOP package (DGN) drastically
Stage Provides High Current at MOSFET Miller
lowers the thermal resistance to improve long-term
Thresholds
reliability. It is also offered in the standard SOIC-8 (D)
• TTL/CMOS Compatible Inputs Independent of
or PDIP-8 (P) packages.
Supply Voltage
Using a design that inherently minimizes shoot-
• 20-ns Typical Rise and 15-ns Typical Fall Times
through current, these drivers deliver 4A of current
with 1.8-nF Load
where it is needed most at the Miller plateau region
• Typical Propagation Delay Times of 25 ns with
during the MOSFET switching transition. A unique
Input Falling and 35 ns with Input Rising
BiPolar and MOSFET hybrid output stage in parallel
also allows efficient current sourcing and sinking at
• 4-V to 15-V Supply Voltage
low supply voltages.
• Dual Outputs Can Be Paralleled for Higher Drive
The UCC2742x provides enable (ENB) functions to
Current
have better control of the operation of the driver
• Available in Thermally Enhanced MSOP
applications. ENBA and ENBB are implemented on
PowerPAD™ Package
pins 1 and 8 which were previously left unused in the
• Rated From –40°C to 125°C
industry standard pin-out. They are internally pulled
up to V
DD
for active high logic and can be left open
2 Applications
for standard operation.
• Switch Mode Power Supplies
Device Information
(1)
• DC/DC Converters
PART NUMBER PACKAGE BODY SIZE (NOM)
• Motor Controllers
SOIC (8) 4.90 mm × 3.91 mm
UCC27423
• Line Drivers
UCC27424 MSOP-PowerPAD (8) 3.00 mm × 3.00 mm
UCC27425
• Class D Switching Amplifiers
PDIP (8) 9.81 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Application Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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