Datasheet 搜索 > 电容排 > AVX（艾维克斯） > W2A4ZC104MAT2A 数据手册 > W2A4ZC104MAT2A 其他数据使用手册 3/6 页
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W2A4ZC104MAT2A 其他数据使用手册 - AVX（艾维克斯）
制造商:
AVX（艾维克斯）
分类:
电容排
封装:
0508
描述:
AVX W2A4ZC104MAT2A 电容阵列, 0.1 µF, ± 20%, 4元件, 10 V, 0508 [1220公制], SMD
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W2A4ZC104MAT2A数据手册
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Page <3> V1.030/05/14
Multilayer SMD Ceramic Capacitor Arrays
4 x 0402, 4 x 0603 Size, NP0, X7R & Y5V Dielectrics, 10V to 100V (MCY4C Series)
No Item Test Condition Requirements
4
Dielectric
Strength
To apply 250% rated voltage.
Duration: 1 to 5 sec.
Charge and discharge current less than
50mA.
No evidence of damage or ash over during test.
5
Insulation
Resistance
To apply rated voltage for max. 120
sec.
≥10GΩor RxC≥500Ω-F whichever is smaller.
6
Temperature
Coefcient
With no electrical load.
T.C. Operating Temp
NP0 55~125°C at 25°C
X7R 55~125°C at 25°C
Y5V 25~85°C at 20°C
T.C. Capacitance Change
NP0 Within ±30ppm/°C
X7R Within ±15%
Y5V Within +30%/-80%
7.
Adhesive
Strength of
Termination
Pressurizing force:
5N (≤0603) and 10N (>0603)
Test time: 10±1 sec.
No remarkable damage or removal of the terminations.
8
Vibration
Resistance
Vibration frequency: 10~55 Hz/min.
Total amplitude: 1.5mm
Test time: 6 hrs. (Two hrs each in three
mutually perpendicular directions.)
Measurement to be made after keeping
at room temp. for 24±2 hrs.
No remarkable damage.
Cap change and Q/D.F.: To meet initial spec.
9 Solderability
Solder temperature: 235±5°C
Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area
10 Bending Test
The middle part of substrate shall be
pressurized by means of the pressur-
izing rod at a rate of about 1mm per
second until the deection becomes
1mm and then the pressure shall be
maintained for 5±1sec.
Measurement to be made after keeping
at room temp. for 24±2 hrs.
No remarkable damage.
Cap change:
NP0: within ±5% or ±0.5pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance
under specied exure of substrate from the capacitance
measured before the test.)
11
Resistance
to Soldering
Heat
Solder temperature: 260±5°C
Dipping time: 10±1 sec
Preheating: 120 to 150°C for 1 min-
ute before immerse the capacitor in a
eutectic solder.
Before initial measurement (Class II
only): Perform 150+0/-10°C for 1 hr and
then set for 24±2 hrs at room temp.
Measurement to be made after keeping
at room temp. for 24±2 hrs.
No remarkable damage.
Cap change:
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R: within ±12.5%
Y5V: within ±30%
Q/D.F., I.R. and dielectric strength: To meet initial
requirements.
25% max. leaching on each edge.
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